Special protection for Al pad to prevent corrosion
Positive photoresist / Negative photoresist
→ Product Number
RTS-PR10-3
RTS-PR10-3-D1
RTS-PR10-A
RTS-JR1
→ Main Ingredient
TMAH/DMSO
Alcoholamine/Alcohol Ether
TMAH/DMSO
TMAH/DMSO
→ Operating Temperature
45~80℃
60~80℃
60~80℃
45~60℃
→ Scope of Application
Positive photoresist (< 20um)
Positive photoresist
Dry Film
Negative photoresist
→ Feature of Product
High metal selectivity ratio Special protection against corrosion for PI/PBO
Non-DMSO, Non-TMAH, Non-NMP
High metal selection ratio, better corrosion protection for Sn/Ag bump, and thick photoresist removal, such as Cu pillar products, which can significantly shorten the process time
High metal selectivity ratio
→ Product Number
RTE-AU1000AP
→ Main Ingredient
KI+I2
→ Operating Temperature
35~45℃
→ Current Density
< 40 ℃
→ Etching rate (A/sec)
130
→ Featured products
High metal selectivity ratio
→ Product Number
RTE-TiA25
Ti-893
Ti-8020-D
RTE-Ti01
→ Main Ingredient
two dose form
HF
F salt + H2O2
HF+H2O2
→ Operating Temperature
30~40℃
RT
RT
RT
→ Etching rate (A/sec)
11~22
10~40
25
125
→ Undercut
< 1
< 1
< 1
< 1
→ Scope of Application
Ti/TiW
Ti
Ti
Ti
→ Feature of Product
High metal selectivity ratio, no corrosion of PI
High metal selectivity ratio, no corrosion of PI
No titanium residue on PI
High metal selectivity ratio, no corrosion of PI, no titanium residue on PI
→ Product Name
Plating Solution
Electroless Plating Solution
Replacement Gold Plating Solution
→ Product Number
Aurotek ST 10
Aurotek SI 3
Aurotek CN 1.2
→ Main Ingredient
Gold Sulfite
Gold Sulfite
Potassium Gold Cyanide
→ Feature of Product
Good adhesion
→ Product Name
Pure Palladium Plating Solution
Electroless Plating Solution
→ Product Number
Palladiumtek AS5
Palladiumtek EP6
→ Main Ingredient
Ammonium Palladium Sulfate
Tetraammonium Dichloride Palladium
→ Feature of Product
Good adhesion, low stress
Good adhesion, low stress
→ Product Name
Non-cyanide neutral plating solution
Non-cyanide alkaline plating solution
→ Product Number
Silvetek MS 40
Silvetek MH 40
→ Main Ingredient
Non-cyanide
Non-cyanide
→ Operating Temperature
30±5℃
40±5℃
→ Current density
0.5 ± 0.3 ASD
0.8 ± 0.3 ASD
→ Coating Thickness
> 10um
> 30um
→ Feature of Product
Cyanide free
→ Product Name
electroless plating solution
electroless plating solution
semi-gloss plating solution
→ Product Number
Nickeltek EL 5
Nickeltek EL 6
Nickeltek N 65
→ Main Ingredient
Nickel sulfate
Nickel sulfate
Nickel amidesulfonate
→ Feature of Product
High stability medium and low phosphorus coating
High stability and high phosphorus coating
Semi-gloss low stress coating
→ Product Number
Tintek LF-TIN300
Tintek SA-TIN400
→ Main Ingredient
Tin methane sulfonate(Stannous Methanesulfonate)
Tin methane sulfonate(Stannous Methanesulfonate)
→ CAS No.
53408-94-9
53408-94-9
→ Chemical Formula
Sn(CH 3 SO 3 ) 2
Sn(CH 3 SO 3 ) 2
→ Tin Content
Sn > 300 g/L
Sn > 400 g/L
→ Scope of Application
Metal salt supplement solution
Metal salt supplement solution
→ Feature of Product
Low metal impurities and low free acid content
Low metal impurities and low free acid content
→ Product Number
Coppertek M128
→ Main Ingredient
Copper Methanesulfonate
→ CAS No.
54253-62-2
→ Chemical Formula
Cu(CH 3 SO 3 ) 2
→ Copper Content
Cu > 128 g/L
→ Scope of Application
Metal salt supplement solution
→ Feature of Product
Low metal impurities and low free acid content
→ Product Number
MSA-Ag
→ Main Ingredient
Silver Methanesulfonate
→ CAS No.
2386-52-9
→ Chemical Formula
Ag(CH 3 SO 3 )
→ Silver Content
Ag > 128 g/L
→ Scope of Application
Metal salt supplement solution
→ Feature of Product
Low metal impurities and low free acid content
→ Product Number
Coppertek M80
Coppertek S30+
Coppertek SS323
Coppertek SS313
→ Main Ingredient
Copper Methanesulfonate
Copper Sulfate
Copper Sulfate
Copper Sulfate
→ Operating Temperature
35~45℃
23~27 ℃
23~27 ℃
23~27 ℃
→ Current Density
15~30 ASD
3~9 ASD
2~6 ASD
2~6 ASD
→ Scope of Application
Cu pillar/RDL/UBM
Cu pillar/RDL/UBM
RDL/UBM
RDL/UBM
→ Product Features
Coating thickness <200um Opening size < 15um
Coating thickness <20um Line width size>1um
Good thermal stability and good mechanical strength (111) Double crystal ratio >30%
Good thermal stability and good mechanical strength (111) Double crystal ratio >95%
